Electronic device including uniaxial conductive adhesive and met

Details Electronic device including uniaxial conductive adhesive and met Electronic device including uniaxial conductive adhesive and met

1986-12-19

1988-01-19

Edlow, Martin H.

357 67, 357 88, 357 65, 357 70, H01L 2328

Patent

active

047207400

ABSTRACT:
An electronic device made by the method of connecting a circuit member (18) having a plurality of laterally spaced electrically conductive terminals (20) to a substrate (12) including a mounting surface (14) having a plurality of laterally spaced conductive paths (16) wherein the method includes the steps of applying an adhesive (22) including a resin having a twenty to twenty-five percent by weight content of conductive metal particles over the mounting surface (14) of the substrate (12) having the conductive paths (16) wherein the resin is a dielectric preventing conductivity between the spaced metal particles therein and mounting the circuit member (18) on the adhesive (22) while vertically aligning the conductive terminals (20) over preselected ones of the conductive paths (16). The percent by weight content of the conductive metal particles in the adhesive (22) is concentrated between each conductive terminal (20) and the vertically aligned conductive paths (16) to between forty to fifty percent by weight to decrease the spacing between the metal particles allowing conductivity through the resin and making the resin uniaxially conductive vertically aligned between the conductive terminal (20) and conductive path (16) while the resin unconcentrated adhesive (22) remains nonconductive between laterally spaced terminals (20) and conductive paths (16).

REFERENCES:
patent: 4001655 (1977-01-01), Voyles et al.
patent: 4039904 (1977-08-01), Klein et al.
patent: 4093972 (1978-06-01), Voyles
patent: 4113981 (1978-09-01), Fujita et al.
patent: 4483067 (1984-11-01), Parmentier

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