Electronic device housing with temperature management functions

Details Electronic device housing with temperature management functions Electronic device housing with temperature management functions

1989-07-06

1991-09-03

Picard, Leo P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361388, 361389, 361424, H05K 900

Patent

active

050459716

ABSTRACT:
The electronic device housing employs unique temperature management functions. Thermally sensitive electronic components are thermally isolated from the environment and from temperature generating components provided within the housing through the use of an insulative case material. Furthermore, heat generating components are connected to the outside environment with a conductive thermal path which is isolated from the remaining components provided within the case, thereby efficiently transferring undesired heat to the environment without allowing the heat to substantially affect remaining components in the housing. The electronic device housing includes a case and a cover formed by molding using a synthetic resin, and a metallic layer formed on the surface of the case which cooperates with the cover to provide an electromagnetic shield for the case. Further, a waterproof seal is provided in the abutment between the case and the cover and the heat radiating effect of the case is enhanced by a heat radiation plate provided outside the case and connected to any heat generating components. The electronic device of such construction is easy to machine, light in weight and inexpensive.

REFERENCES:
patent: 4004194 (1977-01-01), Doerslinger et al.
patent: 4249033 (1981-02-01), Darakjy et al.

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