Electronic device housing

Radiant energy – Photocells; circuits and apparatus – Optical or pre-photocell system

Reexamination Certificate

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Details

C250S239000, C361S748000, C029S592100

Reexamination Certificate

active

07939796

ABSTRACT:
An electronic device housing includes a metallic base part101; a resin part402fixed to the base part101; and a printed circuit board104coming into contact with the resin part402; wherein bonding of the base part101to the resin part402is carried out by way of a nanomold technique and wherein the resin part402has insulating property.

REFERENCES:
patent: 6901682 (2005-06-01), Igaki et al.
patent: 7414238 (2008-08-01), Igarashi et al.
patent: 2007/0070298 (2007-03-01), Hara et al.
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patent: 8-148873 (1996-06-01), None
patent: 08-148873 (1996-06-01), None
patent: 2002340624 (2002-11-01), None
patent: 2003014497 (2003-01-01), None
patent: 2004050488 (2004-02-01), None
patent: 2004-268936 (2004-09-01), None
patent: 2005053179 (2005-03-01), None
patent: 2006035686 (2006-04-01), None
Japanese Office Action, dated Sep. 7, 2010, issued in application No. 2008-509806.
Taiwanese Office Action, dated Sep. 23, 2010, issued in Application No. 096111551.

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