Electronic device having wiring substrate and lead frame

Details Electronic device having wiring substrate and lead frame Electronic device having wiring substrate and lead frame

2007-10-25

2009-11-03

Zameke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257SE23052, C257S686000

Reexamination Certificate

active

07612434

ABSTRACT:
An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, respectively. The first and the second grooves correspond to a connection portion between the first and the second substrates and the lead frame. The lead frame is connected to the first and the second substrates in such a manner that one end of the lead frame is engaged in both of the first and the second grooves through a conductive bonding material.

REFERENCES:
patent: 5563442 (1996-10-01), Mahulikar et al.
patent: 5780926 (1998-07-01), Seo
patent: 6316825 (2001-11-01), Park et al.
patent: 6545345 (2003-04-01), Glenn et al.
patent: 6559525 (2003-05-01), Huang
patent: 2005/0189640 (2005-09-01), Grundy et al.
patent: A-4-3453 (1992-01-01), None
patent: A-5-326817 (1993-12-01), None
patent: A-6-334059 (1994-12-01), None
patent: A-8-213531 (1996-08-01), None
patent: A-2000-307027 (2000-11-01), None
patent: A-2001-68582 (2001-03-01), None
patent: A-2001-210736 (2001-08-01), None

Affiliated with

Also associated with

Rating

Electronic device having wiring substrate and lead frame does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic device having wiring substrate and lead frame, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device having wiring substrate and lead frame will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4114804