Electronic device having wiring substrate and lead frame

Details Electronic device having wiring substrate and lead frame Electronic device having wiring substrate and lead frame

2007-12-04

2007-12-04

Zarneke, David A. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257SE23052, C257S686000

Reexamination Certificate

active

11034139

ABSTRACT:
An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, respectively. The first and the second grooves correspond to a connection portion between the first and the second substrates and the lead frame. The lead frame is connected to the first and the second substrates in such a manner that one end of the lead frame is engaged in both of the first and the second grooves through a conductive bonding material.

REFERENCES:
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patent: 5780926 (1998-07-01), Seo
patent: 6316825 (2001-11-01), Park et al.
patent: 6545345 (2003-04-01), Glenn et al.
patent: 6559525 (2003-05-01), Huang
patent: 2005/0189640 (2005-09-01), Grundy et al.
patent: A-4-3453 (1992-01-01), None
patent: A-5-326817 (1993-12-01), None
patent: A-6-334059 (1994-12-01), None
patent: A-8-213531 (1996-08-01), None
patent: A-2000-307027 (2000-11-01), None
patent: A-2001-68582 (2001-03-01), None
patent: A-2001-210736 (2001-08-01), None

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