Electronic device having self-aligning solder pad design

Details Electronic device having self-aligning solder pad design Electronic device having self-aligning solder pad design

1997-06-02

2000-07-04

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361749, 174260, 174261, 29834, 22818021, H05K 706

Patent

active

060847824

ABSTRACT:
A substrate (200) to which a component (210) is mounted includes at least two mounting pads (215, 220) formed thereon for electrically coupling to a single terminal of the component (210) and for aligning the component (210) on the substrate (200) during a reflow operation.

REFERENCES:
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patent: 4641222 (1987-02-01), Derfiny et al.
patent: 4645114 (1987-02-01), Van Den Brekel et al.
patent: 4836435 (1989-06-01), Napp et al.
patent: 5011066 (1991-04-01), Thompson
patent: 5311405 (1994-05-01), Tribbey et al.
patent: 5449110 (1995-09-01), Tsuji et al.
patent: 5453581 (1995-09-01), Liebman et al.

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