Electronic device having profiled elements extending from...

Details Electronic device having profiled elements extending from... Electronic device having profiled elements extending from...

2007-11-30

2011-10-04

Cao, Phat (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257SE23031

Reexamination Certificate

active

08030742

ABSTRACT:
Embodiments provide an electronic device including a leadframe, a chip attached to the leadframe, and encapsulation material disposed over a portion of the leadframe. The leadframe includes a first main face opposite a second main face and a plurality of edges extending between the first and second main faces. At least one of the plurality of edges includes a first profiled element and a second profiled element different than the first profiled element. The encapsulation material is disposed over the chip and the plurality of edges of the leadframe.

REFERENCES:
patent: 5041902 (1991-08-01), McShane
patent: 5328870 (1994-07-01), Marrs
patent: 5381042 (1995-01-01), Lerner et al.
patent: 5990554 (1999-11-01), Golubic et al.
patent: 2002/0074147 (2002-06-01), Tan et al.
patent: 2005/0258521 (2005-11-01), Park et al.
patent: 2005/0260795 (2005-11-01), Park et al.
patent: 2006/0220187 (2006-10-01), Elliott et al.
patent: 2009/0039486 (2009-02-01), Shimazaki et al.

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