Electronic device having multilayer wiring structure

Details Electronic device having multilayer wiring structure Electronic device having multilayer wiring structure

1980-06-20

1982-09-14

Simmons, David A.

Stock material or miscellaneous articles

Composite

Of quartz or glass

128447, 556450, B32B 1706

Patent

active

043496091

ABSTRACT:
An improved electronic device having a multilayer wiring structure. An interlayer insulation layer or at least one of plural interlayer insulation layers, formed between metal wiring layers, is comprised of a cured coating of a ladder-type silsesquioxane polymer. A layer for protecting a metal wiring layer or layers may also be comprised of a cured coating of a similar polymer. The specified cured coating exhibits good resistance to heat and moisture and enhanced levelling on a pattern.

REFERENCES:
patent: 4103045 (1978-07-01), Lesaicherre
patent: 4273420 (1981-06-01), Watanabe

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