Electronic device having lead and cadmium free electronic...

Details Electronic device having lead and cadmium free electronic... Electronic device having lead and cadmium free electronic...

2003-05-07

2010-06-22

Talbot, Brian K (Department: 1792)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S276000, C427S397700

Reexamination Certificate

active

07740899

ABSTRACT:
The present invention provides an electronic device having a lead-free and cadmium-free glass composition applied thereto and fired to form an acid resistant overglaze, and a method of overglazing an electronic device using the lead-free and cadmium-free glass composition. The lead-free and cadmium-free glass composition fuses at low firing temperatures and is particularly suitable for use in thick film pastes. The glass composition forms predominantly bismuth titanate and/or zinc titanate crystals upon firing. Preferably, glass compositions include by weight from about 11% to about 52% SiO2, from 3.4% to about 40% TiO2, up to about 75% Bi2O3, up to about 40% by weight ZnO, where the sum of Bi2O3and ZnO comprises from about 15% to about 85% of the glass composition by weight.

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