Electronic device having improved electrical connection

Details Electronic device having improved electrical connection Electronic device having improved electrical connection

2006-01-31

2009-06-23

Bui, Hung S (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S800000, C361S807000

Reexamination Certificate

active

07551448

ABSTRACT:
The invention is directed to a method and apparatus for electrically interconnecting multiple electronic components together by disposing the electronic components between two opposing plurality of protrusions that hold the electrical components together and establish an electrical connection therebetween. Each plurality of protrusions may be disposed in an offset arrangement with the opposing protrusions. The opposing protrusions cause the electronic components to bend and adopt a deflected geometry when they are positioned between the opposing sets of protrusions. This bending results in the electronic components being biased against each other so that electrical contacts on each electronic component may be held together and thereby form an electrical connection. As a result, the opposing sets of protrusions can be used to electrically interconnect a plurality of electrical components in the absence of clamping, adhesion, soldering, or pinching.

REFERENCES:
patent: 3686612 (1972-08-01), Clements
patent: 4468074 (1984-08-01), Gordon
patent: 4647125 (1987-03-01), Landi et al.
patent: 4655524 (1987-04-01), Etzel
patent: 4691972 (1987-09-01), Gordon
patent: 4717345 (1988-01-01), Gordon et al.
patent: 4744764 (1988-05-01), Rubenstein
patent: 4752247 (1988-06-01), Warnars
patent: 4768971 (1988-09-01), Simpson
patent: 4913656 (1990-04-01), Gordon et al.
patent: 5219303 (1993-06-01), Daly et al.
patent: 5306546 (1994-04-01), Schreiber et al.
patent: 5313848 (1994-05-01), Santin et al.
patent: 5450664 (1995-09-01), Babow et al.
patent: 5519201 (1996-05-01), Templeton, Jr. et al.
patent: 5677568 (1997-10-01), Ochi et al.
patent: 5885091 (1999-03-01), Belanger, Jr. et al.
patent: 5986886 (1999-11-01), Sasov
patent: 6007669 (1999-12-01), Crumly et al.
patent: 6027958 (2000-02-01), Vu et al.
patent: 6288905 (2001-09-01), Chung
patent: 6293470 (2001-09-01), Asplund
patent: 6302704 (2001-10-01), Belanger, Jr.
patent: 6320512 (2001-11-01), Nicholson et al.
patent: 6411916 (2002-06-01), Pellerin
patent: 6462955 (2002-10-01), Roberts
patent: 6492717 (2002-12-01), Gore et al.
patent: 6886246 (2005-05-01), Chung
patent: 7008240 (2006-03-01), Wang et al.
patent: 7063561 (2006-06-01), Pabst
patent: 7154758 (2006-12-01), Welling et al.
patent: 7237724 (2007-07-01), Singleton
patent: 2002/0126458 (2002-09-01), Sasaki
patent: 2003/0047353 (2003-03-01), Yamaguchi et al.
patent: 2005/0168339 (2005-08-01), Arai et al.
patent: 2005/0168340 (2005-08-01), Mosher et al.
KSW—TempSens®, “The Smart Label with Temperature Monitoring Function,” Smart & Active Technologies by KSW Microtec brochure, 3 pages.

Affiliated with

Also associated with

Rating

Electronic device having improved electrical connection does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic device having improved electrical connection, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device having improved electrical connection will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4056076