Electronic device having external terminals with lead-free...

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

Reexamination Certificate

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Details

C428S646000, C428S648000, C428S926000, C428S929000, C257S779000

Reexamination Certificate

active

10735900

ABSTRACT:
A resin sealed IC has a plurality of external terminals. A metal thin film made of a Sn—Bi alloy is formed in direct contact with the surface of a base member of each external terminal. A Bi content in the Sn—Bi alloy layer is within a range of 0.5 to 6.0 wt %. Further, the Sn—Bi alloy layer has a single-layer plating structure, and the film thickness is within a range of 10 to 25 MIC.

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patent: 2001-257303 (2001-09-01), None
patent: 2002-141456 (2002-05-01), None
patent: 2002-151838 (2002-05-01), None

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