Electronic device having E-PAC chassis for spatial arrangement o

Details Electronic device having E-PAC chassis for spatial arrangement o Electronic device having E-PAC chassis for spatial arrangement o

1995-05-16

1997-11-25

Phillips, Michael W.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361826, H05K 712, H02B 120

Patent

active

056918810

ABSTRACT:
An electronic device has a chassis configured to hold multiple electronic components in a predefined three-dimensional arrangement whereby some of the electronic components are positioned elevationally above, and overlapping, other electronic components. Each electronic component has an external dimension which falls within a tolerance range between a lower acceptable tolerance limit and an upper acceptable tolerance limit. The chassis has form fitting recesses to receive and hold the electronic components. Each chassis recess is undersized relative to the lower acceptable tolerance limit for the external dimension of an associated electronic component, but the chassis has effective compliant qualities to receive and hold an electronic component even if it has an external dimension at the upper acceptable tolerance limit. The electronic components are interconnected by conductive cables. The chassis has patterned cable channels formed therein to hold and guide the cables through predefined locations within the electronic device between the electronic components.

REFERENCES:
patent: 3363957 (1968-01-01), Basch
patent: 4061228 (1977-12-01), Johnson
patent: 4166531 (1979-09-01), Fujiwara
patent: 4241829 (1980-12-01), Hardy
patent: 4241830 (1980-12-01), Di Gesu'
patent: 4792045 (1988-12-01), Creaden
patent: 4828115 (1989-05-01), Wiegand et al.
patent: 5002184 (1991-03-01), Lloyd
patent: 5111362 (1992-05-01), Flamm et al.
patent: 5442518 (1995-08-01), Beam
Robert Cole, "Fast Fabrication With Foam Chassis", Machine Design, Mar. 9, 1995, pp. 115-120.

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