Electronic device having dewing prevention structure and...

Details Electronic device having dewing prevention structure and... Electronic device having dewing prevention structure and...

2005-02-08

2005-02-08

Zarneke, David A. (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S712000

Reexamination Certificate

active

06853071

ABSTRACT:
The electronic device includes a semiconductor device, a substrate on which the semiconductor device is mounted, a flange member for holding a peripheral portion of the substrate and a cooling member, in which the flange member for supporting the substrate of the semiconductor device being thermally in contact with the cooling member is arranged to come into contact with a heater through an adapter and between the heater and the cooling member, a heat insulating material is filled.

REFERENCES:
patent: 5126829 (1992-06-01), Daikoku et al.
patent: 5574627 (1996-11-01), Porter
patent: 6054676 (2000-04-01), Wall et al.
patent: 6144013 (2000-11-01), Chu et al.
patent: 6243268 (2001-06-01), Kang et al.
patent: 6246581 (2001-06-01), Kang et al.
patent: 6292365 (2001-09-01), Ashiwake et al.
patent: 2000-101000 (2000-04-01), None

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