Electronic device having a plug-in unit with a heat sink structu

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

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Details

16510433, 174 152, 361719, 439485, H05K 720

Patent

active

059461918

ABSTRACT:
A heat sink structure for an electronic device of the type having a chassis and a plug-in unit provides efficient heat dissipation for a heat-generating component on a printed circuit board within the unit. In a preferred embodiment, a first heat pipe is fixedly attached to a heat dissipating plate for the heat generating component. At the opposite end, the first heat pipe is held by a connector plug attached to the unit. At one end, a second heat pipe is held by a plug-receiving seat that is fixedly attached to a backboard of the chassis. At the opposite end, the second heat pipe is fixedly attached to a heat dissipating portion on the chassis. The first heat pipe, plug, plug-receiving seat and second heat pipe transfer heat from the heat-generating component to the heat-dissipating portion.

REFERENCES:
patent: 4366526 (1982-12-01), Lijoi
patent: 5343358 (1994-08-01), Hilbrink
patent: 5365749 (1994-11-01), Porter
patent: 5646822 (1997-07-01), Bhatia
patent: 5718282 (1998-02-01), Bhatia

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