Electronic device handler for a bonding apparatus

Details Electronic device handler for a bonding apparatus Electronic device handler for a bonding apparatus

2006-10-19

2009-08-04

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Moving work

C228S049500

Reexamination Certificate

active

07568606

ABSTRACT:
A bonding apparatus is provided which includes a device handler for handling electronic devices, the bonding apparatus including a bonding tool at which the electronic devices are locatable for bonding. A storage assembly is provided for storing multiple electronic devices and a conveying track is further provided for conveying electronic devices towards and away from the bonding tool. The device handler includes a rotary platform for holding an electronic device, and which is operable between an orientation wherein the rotary platform is aligned with the conveying track for transferring an electronic device between the rotary platform and the conveying track, and another orientation wherein the rotary platform is aligned with the storage assembly for transferring an electronic device between the rotary platform and the storage assembly.

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