Electronic device for managing and dissipating heat and for impr

Details Electronic device for managing and dissipating heat and for impr Electronic device for managing and dissipating heat and for impr

1989-03-06

1991-03-12

Envall, Jr., Roy N.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361401, H05K 720, H05K 118

Patent

active

049997408

ABSTRACT:
A high circuit density printed circuit board is manufactured on a metal substrate by building a layer of photoimageable dielectric on the metal substrate and then imaging the dielectric in a manner so as to create wells for active components which are mounted directly on the metal substrate for the purpose of heat dissipation. The build up of the dielectric layer can be improved to provide circuit traces such as, for example, buried coaxial cables prior to the imaging process to achieve even higher density with conventional circuit boards.

REFERENCES:
patent: 3739232 (1973-06-01), Grossman et al.
patent: 4525247 (1985-06-01), McMonagle
patent: 4526810 (1985-07-01), Nesbitt
patent: 4829403 (1989-05-01), Harding

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