Compositions – Electrically conductive or emissive compositions – Free metal containing
Reexamination Certificate
2011-07-05
2011-07-05
Kopec, Mark (Department: 1766)
Compositions
Electrically conductive or emissive compositions
Free metal containing
C252S520300, C428S403000, C428S570000, C427S058000, C427S096100
Reexamination Certificate
active
07972540
ABSTRACT:
A process to fabricate an electronic device comprising: (a) liquid depositing a composition comprising a liquid, silver-containing nanoparticles, a replacement stabilizer comprising a carboxylic acid on the surface of the silver-containing nanoparticles, and a residual amount of an initial stabilizer on the surface of the silver-containing nanoparticles, resulting in a deposited composition; and (b) heating the deposited composition to form an electrically conductive layer comprising silver.
REFERENCES:
patent: 4186244 (1980-01-01), Deffeyes et al.
patent: 5147841 (1992-09-01), Wilcoxon
patent: 5658499 (1997-08-01), Steinberg et al.
patent: 6103868 (2000-08-01), Heath et al.
patent: 6572673 (2003-06-01), Lee et al.
patent: 6688494 (2004-02-01), Pozarnsky et al.
patent: 6730400 (2004-05-01), Komatsu et al.
patent: 6878184 (2005-04-01), Rockenberger et al.
patent: 7160525 (2007-01-01), Peng et al.
patent: 7737497 (2010-06-01), Li
patent: 2004/0004209 (2004-01-01), Matsuba et al.
patent: 2005/0129843 (2005-06-01), Wu et al.
patent: 2006/0060885 (2006-03-01), Wu et al.
patent: 2006/0073667 (2006-04-01), Li et al.
patent: 2006/0254387 (2006-11-01), Lee et al.
P. Buffat and J-P. Borel, “Size effect on the melting temperature of gold particles”,Physical Review A, vol. 13, No. 6, pp. 2287-2298 (Jun. 1976).
S. B. Fuller, E. J. Wilhelm, and J. M. Jacobson, “Ink-Jet Printed Nanoparticle Microelectromechanical Systems”,Journal of Microelectromechanical Systems, vol. 11, No. 1, pp. 54-60 (Feb. 2002).
X. Z. Lin, X. Teng, and H. Yang, “Direct Synthesis of Narrowly Dispersed Silver Nanoparticles Using a Single-Source Precursor”,Langmuir, vol. 19, pp. 10081-10085 (published on web Nov. 1, 2003).
Li Yuning
Ong Beng S
Faye Sharpe LLP
Kopec Mark
Soong Zosan S.
Thomas Jaison P
Xerox Corporation
LandOfFree
Electronic device fabrication process does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic device fabrication process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device fabrication process will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2682194