Electronic device enclosures having improved ventilation to...

Details Electronic device enclosures having improved ventilation to... Electronic device enclosures having improved ventilation to...

2011-03-08

2011-03-08

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S692000, C454S184000

Reexamination Certificate

active

07903405

ABSTRACT:
Electronic device enclosures providing improved heat dissipation are described herein. An example enclosure for holding an electronic circuit board includes a housing having a first portion coupled to a second portion to form a cavity to hold the electronic circuit board. Each of the first and second portions comprises openings to direct convention airflow across opposing faces of the electronic circuit board at the same time. A baffle is coupled to the housing to substantially visually obscure the openings and to define a gap between the housing and the baffle to direct the convection airflow across the opposing faces of the electronic circuit board.

REFERENCES:
patent: 4840225 (1989-06-01), Foley et al.
patent: 5914858 (1999-06-01), McKeen et al.
patent: 5995368 (1999-11-01), Lee et al.
patent: 6201705 (2001-03-01), Nygren et al.
patent: 7167641 (2007-01-01), Tam et al.
patent: 7365974 (2008-04-01), Hartung
patent: 7394654 (2008-07-01), Zieman et al.

Affiliated with

Also associated with

Rating

Electronic device enclosures having improved ventilation to... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic device enclosures having improved ventilation to..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device enclosures having improved ventilation to... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2730943