Electronic device encapsulated directly on a substrate

Details Electronic device encapsulated directly on a substrate Electronic device encapsulated directly on a substrate

1998-07-20

2000-10-24

Patel, Nimeshkumar D.

Electric lamp and discharge devices

With luminescent solid or liquid material

Solid-state type

313506, 313512, 313513, H01J 162, H01J 6304

Patent

active

061372242

ABSTRACT:
A method and apparatus for encapsulating one or more small electronic devices, including for example light-emitting diodes, mounted directly on a substrate by providing a three-dimensional formation on the substrate adjacent to the device and injection molding a thermoplastic encapsulating material to cover the device and extend over the three-dimensional formation on the substrate and wherein the encapsulating material mechanically bonds to the three-dimensional formation. A gate plate for use in injection molding a thermoplastic encapsulating material over a small electronic device mounted directly on a substrate including a cavity formed to enclose the device, and a short gate formed entirely within the gate plate having an input for receiving an encapsulating material and an output communicating with the cavity. One or more encapsulated electrical devices mounted directly on a substrate, including, for example, an LED or an array of LEDs, wherein the device is fully and individually encapsulated by an encapsulating material which is injection molded onto and mechanically bonded to the substrate.

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