Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2011-06-14
2011-06-14
Thai, Luan C (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S125000, C257S679000, C257S687000, C257S787000, C257SE21499, C257SE23181
Reexamination Certificate
active
07960215
ABSTRACT:
An electronic device includes: a base; a conductor pattern formed on the base; and a circuit chip electrically connected to the conductor pattern. The electronic device further includes a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes layers stacked in the thickness direction of the base. The lowermost layer of the layers is closest to the base and softer than the layer that is at least one of the remaining layers. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base.
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International Search Report PCT/JP2007/056078, Mailing Date of Jun. 26, 2007.
Notification of Transmittal of Translation of the International Preliminary Report on Patentability (Form PCT/IB/338) of International Application No. PCT/JP2007/056078 mailed Oct. 8, 2009 with forms PCT/IB/373 and PCT/ ISA/237.
Kira Hidehiko
Kobae Kenji
Kobayashi Hiroshi
Takeuchi Shuichi
Fujitsu Limited
Fujitsu Patent Center
Thai Luan C
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