Electronic device cooling arrangement

Details Electronic device cooling arrangement Electronic device cooling arrangement

1998-11-23

1999-11-09

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361709, 361710, 361715, 361719, 257706, 257712, 257724, 257732, 174 162, 165 802, H05K 720

Patent

active

059826215

ABSTRACT:
An electronic device cooling arrangement includes a heat sink bonded to a substrate above a chip on the substrate, the heat sink having a mounting section bonded to the substrate, a face panel section suspended above the chip and defining a tapered center through hole, and a supporting frame section connected between the face panel section and the mounting section, and a tapered heat conductive block mounted in the tapered center through hole and bonded to the chip for quick dissipation of heat from the chip.

REFERENCES:
patent: 5365107 (1994-11-01), Kuraishi et al.

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