Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2005-07-06
2009-06-09
Monbleau, Davienne (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257SE23037, C257SE23039
Reexamination Certificate
active
07545026
ABSTRACT:
An electronic device (ICD) comprises a signal ground contact (LD1) for coupling the electronic device to signal ground, a die pad, and an integrated circuit. The die pad (DPD) is provided with a protrusion (PTR3) that is electrically coupled to the signal ground contact. The integrated circuit (PCH) has a contact pad (GP2) that faces the protrusion of the die pad and that is electrically coupled thereto.
REFERENCES:
patent: 4685998 (1987-08-01), Quinn et al.
patent: 6140708 (2000-10-01), Lee et al.
patent: 6737750 (2004-05-01), Hoffman
patent: 1 357 596 (2003-10-01), None
Harrison Monica D
Monbleau Davienne
NXP B.V.
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