Electronic device cleaning equipment and electronic device...

Details Electronic device cleaning equipment and electronic device... Electronic device cleaning equipment and electronic device...

2006-04-20

2010-11-02

Kornakov, Michael (Department: 1714)

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

C134S002000, C134S034000, C134S036000, C134S042000

Reexamination Certificate

active

07824504

ABSTRACT:
An electronic device cleaning method includes the steps of: placing, on a processing face, a semiconductor substrate having an obverse face portion in which an electronic device is formed so that the processing face faces a reverse face of the semiconductor substrate; diselectrifying at least the reverse face of the semiconductor substrate by irradiating light to the semiconductor substrate by a light source provided at the processing face; and supplying a chemical solution to an obverse face of the semiconductor substrate after the diselectrifying step starts. Whereby, static electricity present on the processing face is removed reliably.

REFERENCES:
patent: 2003/0205253 (2003-11-01), Shibagaki
patent: 2004/0027777 (2004-02-01), Komoriya et al.
patent: 08-150377 (1996-06-01), None
patent: 10-189544 (1998-07-01), None
patent: 11-233473 (1999-08-01), None
patent: 2001-358109 (2001-12-01), None
patent: 2002-158202 (2002-05-01), None
patent: 2002-184660 (2002-06-01), None
Machine Translation: JP10-189544 to Kimura et al. Jul. 1998.
Japanese Office Action, with English translation, issued in Japanese Patent Application No. 2005-276095, mailed Dec. 15, 2009.

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