Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-06-10
2011-10-11
Bui, Hung S (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S818000, C361S800000
Reexamination Certificate
active
08035989
ABSTRACT:
In the invention, a finger board is bent like a “letter V”, and a thickness adjustment plate is provided between the finger boards of modules to be able to move, thereby being able to adjust the height of a finger. Such a configuration enables to increase the contact pressure of the finger by increasing the height of the finger when the finger is inserted, and when the finger is detached, reduce the contact pressure by reducing the height of the finger. This accordingly provides a shield chassis of suppressing any possible noise with no loss of insertability/removability.
REFERENCES:
patent: 6088222 (2000-07-01), Schmitt et al.
patent: 6556432 (2003-04-01), Chen et al.
patent: 6608750 (2003-08-01), Cruz et al.
patent: 6879495 (2005-04-01), Jiang
patent: 7457134 (2008-11-01), Ice
patent: 7924557 (2011-04-01), Li
patent: 09-074293 (1997-03-01), None
patent: 2002-290077 (2002-10-01), None
patent: 2003-152359 (2003-05-01), None
patent: 2007-109985 (2007-04-01), None
Funatsu Junichi
Hara Tsutomu
Ishiki Toshihiro
Antonelli, Terry Stout & Kraus, LLP.
Bui Hung S
Hitachi , Ltd.
LandOfFree
Electronic device chassis and canister does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic device chassis and canister, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device chassis and canister will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4292767