Electronic device assembly with heat dissipation device

Details Electronic device assembly with heat dissipation device Electronic device assembly with heat dissipation device

2011-06-21

2011-06-21

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679470, C361S679520, C361S701000, C361S702000, C165S080500, C165S104210, C165S104260, C165S104330

Reexamination Certificate

active

07965513

ABSTRACT:
An exemplary electronic device assembly includes a printed circuit board with an electronic component thereon, and a heat dissipation device. The heat dissipation device includes a heat sink mounted on the printed circuit board and a heat pipe pivotably engaged with the heat sink. The heat sink includes a main body defining a transverse channel therethrough and an injection aperture at a top of the main body to communicate the channel and an exterior of the main body. The heat pipe is pivotably engaging in the channel of the main body. A gap is defined between the heat pipe and the heat sink. Heat conductive grease is injected into the channel and filled in the gap between the heat pipe and the heat sink to thermally connect the heat sink with the heat pipe.

REFERENCES:
patent: 4345642 (1982-08-01), Ernst et al.
patent: 5960865 (1999-10-01), Costa et al.
patent: 6125035 (2000-09-01), Hood et al.
patent: 6137683 (2000-10-01), Lee et al.
patent: 6359780 (2002-03-01), McMahan et al.
patent: 6377454 (2002-04-01), Inoue et al.
patent: 7327576 (2008-02-01), Lee et al.
patent: 7755900 (2010-07-01), Cheng

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