Electronic device assembly and methods of making same

Details Electronic device assembly and methods of making same Electronic device assembly and methods of making same

1979-03-12

1982-08-24

James, Andrew J.

357 72, 357 68, 357 81, H01L 2348, H01L 2944, H01L 2952

Patent

active

043463967

ABSTRACT:
An electronic device assembly (11) includes a heat dissipating substrate (18) having a seat (16). A device (14) is uniformly spaced from a base surface of the seat (16), and a layer of solder of uniform thickness occupies a gap between the surface of the seat and the device. Leads (31) and (33) extend at a shallow, acute angle from the device. A lead (32) is mounted to a support (28) extending from the substrate (18). Inner portions of the leads (31, 32, 33), the device (14) and portions of the substrate (18), are encased by an envelope (22), while outer portions (67) of the leads and a mounting tab (19) of the substrate extend from the envelope.

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IBM Technical Disclosure Bulletin, by Dunkel, vol. 2, No. 6, Apr. 1960, p. 69.
IBM Technical Disclosure Bulletin, by Dunkel, vol. 14, No. 11, Apr. 1972, p. 3332.

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