Electronic device assembly and method for making

Stock material or miscellaneous articles – Metal continuous phase interengaged with nonmetal continuous...

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428545, 257703, 257709, 164 97, H02J 100

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active

054807271

ABSTRACT:
A single, integral Metal Matrix Composite structure (47) includes a base plate (11), circuit layer (25), and lead supports (30,32), forming the single integral structure (47). Such a structure is particularly suited for power module applications. The various elements are well matched, thermally. Additionally, the structure (47) can be fabricated using straightforward molding processes, rather than complicated, fixtured, bonding and solder processes which are typically used for conventional power modules.

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