Electronic device assembly and a manufacturing method of the sam

Details Electronic device assembly and a manufacturing method of the sam Electronic device assembly and a manufacturing method of the sam

1998-06-02

1999-11-02

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438455, H01L 2144, H01L 2148, H01L 2150, H01L 2130, H01L 2146

Patent

active

059769106

ABSTRACT:
An electronic device assembly includes a large-scale integrated circuit (LSI) chip mounted on a flexible substrate. The flexible substrate is connected to a second substrate via solder. The flexible substrate is also attached to the second substrate via a resin. When the assembly is manufactured, the solder is provided between the substrates. The resin fills an area between the substrates. The solder and the resin are heated simultaneously. The solder melts to electrically connect the substrates. The resin is set to mechanically couple the substrates.

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Article from the Society for Hybrid Micro Electronics entitled "Electronics Mounting technology Basic Lecture", Kogyo Chosa Kai, pp. 258-292, 1994.

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