Electronic device assembly

Details Electronic device assembly Electronic device assembly

1997-10-28

1999-07-13

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174250, 174254, 257737, 257738, 361767, 361760, 361779, H05K 103, H05K 114

Patent

active

059235357

ABSTRACT:
An electronic device assembly includes a rigid, first substrate and a second substrate. The first substrate has a first pad on the upper surface, and a through-hole at a position of the first pad. The second substrate has a second pad on the upper surface thereof. The first and second pads are connected via solder. At least a part of the solder is positioned in the through-hole of the first substrate. The first substrate may include a flexible substrate and a rigid plate. The through-hole is provided in the flexible substrate. The first pad is provided on the lower surface of the flexible substrate. The rigid plate is attached to the flexible substrate. The plate has a hole at a position of the through-hole to make the first pad reachable.

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S. Kayama et al.; "VLSI Packaging Technology", 1993, Nikkei BP, Tokyo, Japan pp. 1-5 and 157-185.
IBM Technical Disclosure Bulletin "Photoformed Chip Carrier" vol. 28, No. 7, dated Dec. 1985.
IBM Tecnical Disclosure Bulletin "Flip-Chip Carrier Assembly For Improved Thermal Performance" vol. 37, No. 07 pp. 207 and 209, dated Sep. 1994.

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