Electronic device assembly

Details Electronic device assembly Electronic device assembly

1995-08-31

1998-05-19

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257774, 257784, H01L 2348, H01L 2352, H01L 2940

Patent

active

057539740

ABSTRACT:
An electronic device assembly includes a large-scale-integrated circuit (LSI) chip having center and peripheral portions. A circuit and terminals are formed in the center in and peripheral portions, respectively. A carrier substrate is attached to the center portion of the LSI chip. The carrier substrate has center and peripheral portions. Bumps and terminals are provided in the center and peripheral portions of the carrier substrate. Wires connect the terminals of the LSI chip and the carrier substrate. The carrier substrate is mounted on a substrate via the bumps. The thermal expansion coefficient of the carrier substrate is between those of the LSI chip and the substrate.

REFERENCES:
patent: 4970575 (1990-11-01), Soga et al.
patent: 4979015 (1990-12-01), Stierman et al.
patent: 5097318 (1992-03-01), Tanaka et al.
patent: 5289346 (1994-02-01), Carey et al.
patent: 5331514 (1994-07-01), Kuroda
patent: 5468995 (1995-11-01), Higgins, III
T.L. Hodson, Ed.; "Die Grid Array Package Provides KGD Solution"; Electronic Packaging & Production 34 (1994) Jun., No. 6, Newton, Mass., p. 40.

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