Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2004-05-28
2008-08-19
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S693000, C257SE23031
Reexamination Certificate
active
07414307
ABSTRACT:
An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.
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European Search Report.
Ebine Hiromichi
Hayashi Masahide
Kikuchi Katsuhiko
Shimada Satoshi
Crowell & Moring LLP
Hitachi , Ltd.
Hitachi Car Engineering Co. Ltd.
Pert Evan
Sandvik Ben P
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