Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2000-08-03
2001-04-10
Nguyen, Khiem (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C361S784000
Reexamination Certificate
active
06213786
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a high-density, multi-pin connector for mounting a pin grid array (PGA) LSI package or a multi-chip module (MCM) board on a main board.
The recent market trend for multi-pin connectors is as follows.
(1) Mainly developed in the field of multi-pin connectors manufactured by connector makers are those having contact-pin pitches, numbers of pins, etc. which are common to boards generally used.
As for the pitches, for example, 2.54 mm and 1.27 mm are typical.
(2) With the progress of MCM boards, they are increased both in board size (~□100 mm) and in number of pins (about 1000 to 10000 pins), which involve increasing also the size of multi-pin connectors onto which such MCM boards are mounted.
Meanwhile, a multi-pin connector is manufactured by, for example, press-fitting contact pins in a housing, or by integrally molding with contact pins set in a mold beforehand.
An example of a multi-pin connector, which is commercially available, is shown in FIG.
17
. In
FIG. 17
, a plurality of contacts
101
are formed on an upper surface of a base portion
100
on which a PGA LSI package to be mounted, and a plurality of pins
102
for connection to the contacts are formed on a lower surface of the base portion.
The conventional multi-pin connectors mentioned above give rise to some problems which will be described below.
First, the commercially available multi-pin connectors have limitations in contact-pin pitch and number of pins. Mounting for accommodating the high density and narrow pitch is necessary to improve the performance of electronic devices. However, such commercially available connectors cannot sufficiently bring out the performance of electronic devices.
Secondly, in view of the above, there is a way of developing connectors for particular specifications. However, this would not only require substantial time and investment for the development of such connectors, but also may affect the development schedule of electronic devices using the connectors.
Thirdly, when the board size is increased due to the high density and narrow pitch as is in MCM boards, connectors are limited in connector size, number of pins and pitch because of restrictions imposed on the forming pressure, the narrow-pitch structure, the housing size, etc. in a connector housing forming machine.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a multi-pin connector which can solve the above problems in the prior art, to be manufactured with ease in a short period of time, and be able to have any pitch and any number of pins.
To achieve the above object, according to the invention, a multi-pin connector is formed with a plurality of contact pins, which are to be connected to input/output pins of a PGA LSI package and/or an MCM board, directly connected to a main board in desired positions.
Further, in the multi-pin connector according to the invention, a guide frame for insertion of an LSI package and/or an MCM board is provided around the outer periphery of the contact pins to improve fitting accuracy between the input/output pins and the contact pins, in view of the increased number of pins and a narrower pitch.
Moreover, for the purpose of protecting the contact pins from external force, dust and so on, a protective cover is provided in a manner of enclosing the upper portions of the contact pins as well as the peripheries of the individual contact pins.
In accordance with the present invention, by arranging and fixing a number of contact pins directly onto a main board in desired positions, a multi-pin connector having any desired pitch and any desired number of pins can be manufactured. It is therefore possible to remarkably shorten the time period for development of connectors and reduce the development cost thereof.
Additionally, since a multi-pin connector having any desired shape can be manufactured, the mounting density of an electronic device can be greatly improved.
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Fukasawa Hideyuki
Imai Tsutomu
Kasai Kenichi
Kuroda Takeshi
Matsui Kiyoshi
Hitachi , Ltd.
Mattingly Stanger & Malur, P.C.
Nguyen Khiem
Zarroli Michael C.
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