Electronic device and module structure thereof

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S720000

Reexamination Certificate

active

07042719

ABSTRACT:
An electronic device. The electronic device comprising a host, and a module structure is disposed in the host for calculating data. The module structure has a first substrate, a process unit, a heat-dissipating device and a second substrate. The first substrate is a motherboard of the electronic device, and the process unit is disposed on the first substrate, and the heat-dissipating device is attached to the process unit and disposed on the first substrate. The first substrate and the second substrate have the same structure and texture. The first substrate and the second substrate are blanketed from a multi-layer structure or sheet used for the motherboard.

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patent: 6141214 (2000-10-01), Ahn
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patent: 6252768 (2001-06-01), Lin
patent: 6373700 (2002-04-01), Wang
patent: 6549404 (2003-04-01), Kitahara et al.
patent: 6556439 (2003-04-01), Shibasaki
patent: 6717815 (2004-04-01), Yang

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