Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-05-09
2006-05-09
Lea-Edmonds, Lisa (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S720000
Reexamination Certificate
active
07042719
ABSTRACT:
An electronic device. The electronic device comprising a host, and a module structure is disposed in the host for calculating data. The module structure has a first substrate, a process unit, a heat-dissipating device and a second substrate. The first substrate is a motherboard of the electronic device, and the process unit is disposed on the first substrate, and the heat-dissipating device is attached to the process unit and disposed on the first substrate. The first substrate and the second substrate have the same structure and texture. The first substrate and the second substrate are blanketed from a multi-layer structure or sheet used for the motherboard.
REFERENCES:
patent: 6122169 (2000-09-01), Liu et al.
patent: 6141214 (2000-10-01), Ahn
patent: 6151214 (2000-11-01), Yeh
patent: 6157539 (2000-12-01), Wagner et al.
patent: 6252768 (2001-06-01), Lin
patent: 6373700 (2002-04-01), Wang
patent: 6549404 (2003-04-01), Kitahara et al.
patent: 6556439 (2003-04-01), Shibasaki
patent: 6717815 (2004-04-01), Yang
Lea-Edmonds Lisa
Quanta Computer Inc.
Thomas, Kayden Horstmeyer & Risley
LandOfFree
Electronic device and module structure thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic device and module structure thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device and module structure thereof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3597444