Electronic device and method of manufacturing the same, chip...

Details Electronic device and method of manufacturing the same, chip... Electronic device and method of manufacturing the same, chip...

2008-01-22

2008-01-22

Wilczewski, Mary (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S119000, C257S687000, C257S782000, C257S783000, C257S784000

Reexamination Certificate

active

07320902

ABSTRACT:
An external terminal is formed on an interconnect pattern formed on a substrate by using a soldering material. Subsequently, a chip component having an electrode is mounted on the substrate. An interconnect for electrically connecting the electrode and the interconnect pattern is formed at a temperature lower than a melting point of the soldering material.

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