Electronic device and method of manufacturing the same

Details Electronic device and method of manufacturing the same Electronic device and method of manufacturing the same

2004-11-01

2010-12-07

Smith, Zandra (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S688000, C257S686000, C257S692000, C257S698000, C257S774000

Reexamination Certificate

active

07847411

ABSTRACT:
An electronic device wherein an electronic element is electrically connected to a substrate through an interposer and a method of manufacturing the same are disclosed. The electronic device comprises an electronic element and an interposer including an interposer base to which the electronic element is joined and plural post electrodes connected to corresponding electrodes of the electronic element. In the electronic device, the electronic element and the interposer base are integrated with each other by being brought into direct contact with each other, and the post electrodes are formed directly on the corresponding electrodes of the electronic element.

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European Search Report: dated Jun. 26, 2009; Application No. EP04799450.

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