Electronic device and method of manufacturing the same,...

Details Electronic device and method of manufacturing the same,... Electronic device and method of manufacturing the same,...

2007-06-12

2007-06-12

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S686000, C257S777000

Reexamination Certificate

active

10788449

ABSTRACT:
An electronic device includes: a substrate on which an interconnect pattern is formed; a chip component having a first surface on which an electrode is formed and a second surface opposite to the first surface, the chip component being mounted in such a manner that the second surface faces the substrate; an insulating section formed of a resin and provided adjacent to the chip component; and an interconnect which is formed to extend from above the electrode, over the insulating section and to above the interconnect pattern.

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New U.S. Appl. No. 10/788,295, Mar. 01, 2004, Hashimoto.
New U.S. Appl. No. 10/788,492, Mar. 01, 2004, Hashimoto.
New U.S. Appl. No. 10/788,447, Mar. 01, 2004, Hashimoto.

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