Electronic device and method of manufacturing same

Details Electronic device and method of manufacturing same Electronic device and method of manufacturing same

2006-02-14

2006-02-14

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C174S050510

Reexamination Certificate

active

06998533

ABSTRACT:
The electronic device (100) comprises a body (20) with a cavity (30) wherein a semiconductor element (10) and a thermally conductive layer (33) are present. The cavity (30) is filled with an encapsulation (35) of an electrically insulating material wherein contact faces (47, 48) are mechanically anchored.

REFERENCES:
patent: 5081563 (1992-01-01), Feng
patent: 5353195 (1994-10-01), Fillion et al.
patent: 5699232 (1997-12-01), Neidig et al.
patent: 5764484 (1998-06-01), Hoffman et al.
patent: 6087721 (2000-07-01), Akhnoukh
patent: 0718882 (1996-06-01), None
patent: 0920058 (1999-06-01), None

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