Electronic device and method of fabricating the same

Details Electronic device and method of fabricating the same Electronic device and method of fabricating the same

2006-05-09

2006-05-09

Nguyen, Tuan H. (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S783000

Reexamination Certificate

active

07042090

ABSTRACT:
An electronic device includes a substrate, a lower conductive film formed on the substrate and a functional film formed on the lower conductive film. In the present invention, an adhesion of the lower conductive film on the side of the substrate is greater than or equal to 0.1 N/cm. The electronic device according to this invention exhibits high mechanical strength that makes it very reliable. This is because the invention prevents the physical exfoliation of the lower conductive film that is apt to occur during or after fabrication of the electronic device when the adhesion of the lower conductive film is lower than 0.1 N/cm.

REFERENCES:
patent: 6045626 (2000-04-01), Yano et al.
patent: 6258459 (2001-07-01), Noguchi et al.
patent: 2003/0121697 (2003-07-01), Nagai et al.
patent: 2004/0069649 (2004-04-01), Katayama et al.
patent: 2005/0224978 (2005-10-01), Kawate et al.
patent: 11260835 (1999-09-01), None
patent: 11-312801 (1999-11-01), None

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