Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-12-29
2010-06-22
Bui, Hung S (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S748000
Reexamination Certificate
active
07742309
ABSTRACT:
An electronic device and method of assembling an electronic device, said device including an electronic component; an electrically insulating protective layer overlaying and in contact with at least a portion of the electronic component; and injection molded material overlaying at least the portion of the component and the overlaying protective layer.
REFERENCES:
patent: 4855868 (1989-08-01), Harding
patent: 5285104 (1994-02-01), Kondo et al.
patent: 6191360 (2001-02-01), Tao et al.
patent: 6683250 (2004-01-01), Luettgen et al.
patent: 6768654 (2004-07-01), Arnold et al.
patent: 6849800 (2005-02-01), Mazurkiewicz
patent: 2003/0019647 (2003-01-01), Luettgen et al.
patent: 2006/0003137 (2006-01-01), Amstutz et al.
patent: 2006/0018098 (2006-01-01), Hill et al.
patent: 2006/0170092 (2006-08-01), Kim et al.
patent: 2006/0221591 (2006-10-01), Kong
patent: 2008/0080141 (2008-04-01), Krokoszinski et al.
patent: 2009/0004557 (2009-01-01), Lasarov et al.
patent: 1065916 (2001-01-01), None
patent: 2418539 (2006-03-01), None
patent: WO2006-017484 (2006-02-01), None
Aapro Teppo
Hakunti Jussi
Kilpi Pekka
Lasarov Harri
Vänskä Anssi
Bui Hung S
Harrington & Smith
Nokia Corporation
LandOfFree
Electronic device and method of assembling an electronic device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic device and method of assembling an electronic device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device and method of assembling an electronic device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4226163