Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-04-11
2006-04-11
Pert, Evan (Department: 2826)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C228S180220
Reexamination Certificate
active
07026188
ABSTRACT:
A manufacturing method of an electronic device comprises the steps of:preparing a printed wiring board having a first region and a second region which differ from each other over one main surface thereof, a first electronic component having a plurality of first projection electrodes over one main surface thereof, and a second electronic component having a plurality of second projection electrodes which have a melting point higher than a melting point of the first projection electrodes over one main surface thereof;mounting the first electronic component on the first region of one main surface of the printed wiring board by melting the plurality of first projection electrodes; andmounting the second electronic component on the second region of one main surface of the printed wiring board by compression-bonding the second electronic component while heating in a state that an adhesive resin is interposed between the second region of one main surface of the printed wiring board and one main surface of the second electronic componentwherein the step of mounting the second electronic component is performed before the step of mounting the first electronic component.
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Sugita Norihiko
Taguchi Kazuyuki
Tanaka Hideki
Miles & Stockbridge P.C.
Pert Evan
Renesas Technology Corp.
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