Electronic device and method for manufacturing electronic device

Details Electronic device and method for manufacturing electronic device Electronic device and method for manufacturing electronic device

1997-12-08

1999-12-14

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361684, 361736, 361772, 361777, 361748, 174 501, 174 5054, 174 522, H05K 118, H05K 330

Patent

active

060025921

ABSTRACT:
An semiconductor device and a method for manufacturing semiconductor devices which are easily made compact. A plurality of semiconductor chips having protrusion electrodes respectively provided on a plurality of electrodes formed on circuit surfaces are integrally sealed by an insulating material so as to cover the circuit surfaces while the circuit surfaces are nearly directed to the same direction and arranged in prescribed conditions, and to expose the respective protrusion electrodes; and insulating layers and wiring layers respectively electrically connected to the corresponding protrusion electrodes are alternately laminated on the insulating material so as to have the desired number of layers in the direction of thickness. Thus, the spaces between the semiconductor chips can be extremely narrowed, and the thickness of the insulating layers and wiring layers can be significantly reduced, so that the semiconductor devices which can be made compact without difficulty and the method capable of easily manufacturing the semiconductor devices in compact forms can be realized.

REFERENCES:
patent: 5013900 (1991-05-01), Hoppe
patent: 5036431 (1991-07-01), Adachi et al.
patent: 5280413 (1994-01-01), Pai
patent: 5581130 (1996-12-01), Boucheron
patent: 5699232 (1997-12-01), Neidig et al.

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