Electronic device and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...

Reexamination Certificate

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C257SE21523

Reexamination Certificate

active

07417304

ABSTRACT:
An electronic device has an element formed in the chip region of a substrate, a plurality of interlayer insulating films formed on the substrate, a wire formed in the interlayer insulating films in the chip region, and a plug formed in the interlayer insulating films in the chip region and connecting to the wire. A seal ring extending through the plurality of interlayer insulating films and continuously surrounding the chip region is formed in the peripheral portion of the chip region. A stress absorbing wall extending through the plurality of interlayer insulating films and discretely surrounding the seal ring is formed outside the seal ring.

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patent: 6365958 (2002-04-01), Ibnabdeljalil et al.
patent: 6498089 (2002-12-01), Komada
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patent: 2003/0160261 (2003-08-01), Moriya
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patent: 2005/0269702 (2005-12-01), Otsuka
patent: 2006/0055005 (2006-03-01), Furusawa et al.
patent: 2001-023937 (2001-01-01), None

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