Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2009-03-31
2010-11-16
Potter, Roy K (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S718000, C257SE23083
Reexamination Certificate
active
07834446
ABSTRACT:
According to an aspect of the present invention, there is provided an electronic device including: a substrate board; a semiconductor device mounted on the substrate board; a heat sink configured to radiate heat from the semiconductor device; a first conductive portion provided on the substrate board; and a second conductive portion provided on the substrate board, the second conductive portion separated from the first conductive portion by a discharge gap, wherein: the heat sink is electrically connected to the first conductive portion; and the second conductive portion is grounded.
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Japanese Office Action dated Jun. 9, 2009; Japanese Patent Application No. 2008-226421.
Japanese Office Action dated Jan. 5, 2010, Japanese Patent Application No. 2009-266963.
Gamou Masayuki
Yajima Takashi
Kabushiki Kaisha Toshiba
Patterson & Sheridan L.L.P.
Potter Roy K
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