Electronic device and manufacturing same

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S840000, C438S106000, C438S127000

Reexamination Certificate

active

07134196

ABSTRACT:
In a method of manufacturing an electronic device, an electronic component and a mount substrate are disposed such that one of surfaces of the electronic component faces toward one of surfaces of the mount substrate, and a connection electrode of the electronic component is electrically connected and mechanically bond to a patterned conductor of the mount substrate. A resin film is then disposed on the electronic component and the mount substrate. A gas captured in between the resin film and the electronic component is sucked through a hole provided in the mount substrate from a side of the mount substrate opposite to the electronic component. The resin film is thereby deformed to closely contact the electronic component and the mount substrate. The resin film is then heated and adhered to the mount substrate.

REFERENCES:
patent: 5612576 (1997-03-01), Wilson et al.
patent: 5997379 (1999-12-01), Kimura
patent: 6057597 (2000-05-01), Farnworth et al.
patent: 6262513 (2001-07-01), Furukawa et al.
patent: 6492194 (2002-12-01), Bureau et al.
patent: A-9-064076 (1997-03-01), None
patent: A-9-162525 (1997-06-01), None
patent: A 10-50879 (1998-02-01), None
patent: A 10-125825 (1998-05-01), None
patent: A 11-510666 (1999-09-01), None
patent: A 2001-53092 (2001-02-01), None
patent: A 2001-176995 (2001-06-01), None
patent: A 2001/189639 (2001-07-01), None
patent: WO 97/02596 (1997-01-01), None
patent: WO 97/45955 (1997-12-01), None

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