Electronic device and manufacturing method thereof

Details Electronic device and manufacturing method thereof Electronic device and manufacturing method thereof

2011-06-28

2011-06-28

Dougherty, Thomas M (Department: 2837)

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

C310S340000, C310S344000

Reexamination Certificate

active

07969072

ABSTRACT:
An electronic device includes: a package including a lid and a package base, the package being formed by bonding the lid to a joint surface of the package base using a bonding material; and a resin portion covering the package. The resin portion covers at least the package base and the bonding material, and at least a part of the resin portion has a section outline. The section outline has an outermost portion thereof in a direction parallel with a mount surface of the electronic device. The outermost portion is located below a lower surface of the lid in a direction perpendicular to the mount surface of the electronic device.

REFERENCES:
patent: 6087759 (2000-07-01), Pfeil
patent: 6703768 (2004-03-01), Kageyama et al.
patent: 2008/0067892 (2008-03-01), Chiba et al.
patent: A-2008-78778 (2008-04-01), None
patent: A-2008-136169 (2008-06-01), None
patent: 2008-300913 (2008-12-01), None
patent: A-2009-60333 (2009-03-01), None
patent: A-2009-60334 (2009-03-01), None

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