Electronic device and manufacturing method of the same

Details Electronic device and manufacturing method of the same Electronic device and manufacturing method of the same

2005-11-18

2008-07-08

Pham, Thanhha (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S127000, C257SE21499

Reexamination Certificate

active

07396701

ABSTRACT:
A technique that makes it possible to enhance the reliability of a module using PCB as its module substrate is provided. Solder connection of a single-chip component43, an integrated chip component44, and a semiconductor chip IC2by Pb-free solder is carried out by heat treatment at a temperature below 280° C. using a heat block. Solder connection of a semiconductor chip IC1by high-melting point solder is carried out by heat treatment at a temperature of 280° C. or higher using a hot jet. Thus, the semiconductor chip IC1can be solder connected to PCB38using high-melting point solder without the following troubles: damage to the PCB38due to heat, for example, burning of solder resist; and peeling of prepreg from a core material. Therefore, the semiconductor chip IC1can be mounted over the PCB38with high connection strength.

REFERENCES:
patent: 7221049 (2007-05-01), Igarashi et al.
patent: 2002-208668 (2002-07-01), None
patent: 2002-368186 (2002-12-01), None

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