Electronic device and manufacturing method

Details Electronic device and manufacturing method Electronic device and manufacturing method

2011-08-09

2011-08-09

Wagner, Jenny L. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C257S795000, C257SE23127

Reexamination Certificate

active

07993984

ABSTRACT:
An electronic device including a semiconductor device with a plurality of bump electrodes, a mounting board connected to the semiconductor device, thermally expandable particles, and adhesive. The thermally expandable particles are provided on the sides of the semiconductor device and the surface of the mounting board around a projected area of the semiconductor device. The adhesive is provided on the sides of the semiconductor device and the surface of the mounting board such that it covers the area of thermally expandable particles. This improves the impact resistance of the semiconductor device soldered onto the mounting board, and also facilitates removal of the semiconductor device from the mounting board when the semiconductor device needs repair.

REFERENCES:
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patent: 6335571 (2002-01-01), Capote et al.
patent: 6373142 (2002-04-01), Hoang
patent: 7323360 (2008-01-01), Gonzalez et al.
patent: 2008/0308930 (2008-12-01), Yoshida
patent: 2001-107019 (2001-04-01), None
patent: 2005-332970 (2005-12-01), None
patent: 2006-100457 (2006-04-01), None
United States Office Action issued in U.S. Appl. No. 12/102,359, dated Jun. 17, 2010.
U.S. Final Office Action issued in U.S. Appl. No. 12/102,359, mailed on Sep. 23, 2010.
Related U.S. Appl. No. 12/102,359 to Yoshida, filed Apr. 14, 2008, entitled “Semiconductor Device Mounting Sturcture, Manufacturing Method, and Removal Method of Semiconductor Device”.

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