Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Reexamination Certificate
2000-12-21
2003-06-03
Reichard, Dean A. (Department: 2831)
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
C361S305000, C361S311000, C361S313000, C361S306100, C438S612000, C438S613000, C257S529000, C257S530000
Reexamination Certificate
active
06574087
ABSTRACT:
TECHNICAL FIELD
The present invention relates to an electronic component and a method for manufacturing the same.
BACKGROUND ART
The request for speeding up information processing has become more and more intensified, and a growing number of semiconductor chips with high frequency have been developed year by year. In order to speed up the semiconductor operation, not only achieving high density and high performance of integrated chips but also improving characteristics of peripheral circuits is necessary. In particular, securing the stability of a transmission line and a power supply line is one of the requirements for the stable high-speed operation. Thus, it is not going too far to say that the main body of a semiconductor chip depends heavily on the peripheral devices.
A capacitor is one of the important devices that secure the stability of the transmission line and the power supply line. In order to realize the high-speed operation, not only should the capacitor have high frequency performance, but also the wiring led thereto should have low impedance.
In order to operate the semiconductor chip with high frequency, it is necessary to arrange the capacitor near the semiconductor chip so as to reduce wiring loss. Conventional methods are limited to those of forming a minute capacitor inside the semiconductor, and this is becoming insufficient for a further high-frequency stable operation. In addition, locating the capacitor in the circumference of the semiconductor chip causes a problem in that a mounted board becomes large.
DISCLOSURE OF INVENTION
It is an object of the present invention to solve the problems noted above and to provide an electronic component and a method for manufacturing the same, wherein suppressing the size increase of the mounted area and locating a capacitor near a semiconductor chip can be realized at the same time.
In order to achieve the above-mentioned object, the present invention has configurations described below.
An electronic component according to the present invention includes electrode layers arranged in opposition to each other, a dielectric interposed between the electrode layers, a connecting electrode that is connected to at least one of the electrode layers, and penetrating electrodes that penetrate the electronic component without being connected to the electrode layers. Since the electronic component of the present invention includes the penetrating electrodes, it is possible, for example, to mount the electronic component of the present invention on a wiring board and dispose another electronic component (for example, a semiconductor chip) thereon to connect this electronic component to the wiring board via the penetrating electrode. Also, since the electronic component of the present invention includes the electrode layers and the dielectric that is interposed between the electrode layers, it is possible, for example, to form a capacitor in the electronic component. As a result, while suppressing the size increase in a mounted area, the capacitor can be arranged near the semiconductor chip, thereby realizing a high frequency driving of the semiconductor chip and suppressing the size increase of the mounted area at the same time.
It is preferable that the penetrating electrodes mentioned above penetrate the electronic component in a direction substantially in parallel to the deposition direction of the electrode layer and the dielectric. The electronic component with such a configuration is easy to manufacture.
In the electronic component of the present invention described above, the penetrating electrodes are arranged like lattice points, the electrode layers include a first electrode layer and a second electrode layer arranged between the penetrating electrodes, and the first electrode layer and the second electrode layer are arranged so as to be crossed with each other like a lattice when seen from a penetrating direction of the penetrating electrodes and so that the dielectric is interposed therebetween. Alternatively, the electrode layers may include a first electrode layer and a second electrode layer that are arranged so as to have a facing portion with a predetermined size and so that the dielectric is interposed therebetween. With this configuration, a capacitor with a desired capacity can be formed easily in the electronic component.
In the electronic component of the present invention, the connecting electrode can be a lead electrode that is formed in the same plane as the penetrating electrode. In other words, the lead electrode and the penetrating electrode can be formed so as to be exposed to the same surface of the electronic component. With this configuration, the lead electrode can be connected to the wiring board, which is used for supplying voltage to the electrode layers in the electronic component, on the same plane as the penetrating electrode (for example, the bottom surface or the top surface of the electronic component) in a similar manner. As a result, the mounted area can be further decreased. Also, another electronic component that is disposed on the electronic component of the present invention can be connected to the lead electrode easily.
In addition, in the electronic component of the present invention, the connecting electrode can be an external electrode that is formed in a different plane than the penetrating electrode. For example, the penetrating electrode is formed so as to be exposed to the upper and lower outer surfaces of the electronic component, and the connecting electrode (the external electrode) is formed on the peripheral surface of the electronic component. With this configuration, when mounting the electronic component of the present invention on the wiring board, the external electrode can be soldered to the wiring board easily.
In the electronic component of the present invention, it is preferable that a plurality of capacitance forming regions are formed between the first electrode layers and the second electrode layers. Thus, a capacitor can be formed inside the electronic component.
It is preferable that the connecting electrodes that are connected to the first electrode layers and the second electrode layers forming the capacitance forming regions are insulated from each other. With this configuration, a plurality of independent capacitors can be formed inside the electronic component.
Furthermore, when the capacitance forming regions with different capacitances are formed, a plurality of capacitors with different capacity can be formed inside the electronic component.
Next, a method for manufacturing the electronic component according to the first configuration of the present invention is described in the following. The method for manufacturing the electronic component including a plurality of metal thin films and dielectric thin films includes (i) depositing a metal thin film, (ii) depositing a dielectric thin film having an opening, and (iii) performing (i) and (ii) a plurality of times, so that the metal thin films are electrically connected to each other via the opening. With this configuration, a simple method can connect desired metal thin films to each other among metal thin films that are layered in the electronic component. Therefore, lead electrodes are formed on the metal thin films that are connected in this manner, enabling a plurality of metal thin films, which are connected, to function as electrode layers with the same electric potential.
In the above-described method for manufacturing the electronic component of the first configuration of the present invention, the dielectric thin film having the opening can be obtained by depositing the dielectric thin film and then irradiating a laser beam to a predetermined portion to remove a part of the dielectric thin film. Thus, the dielectric thin film with the opening can be formed easily and efficiently on a desired position in a precise manner.
It is preferable that the laser beam is a carbon dioxide gas laser. Thus, only the dielectric thin film can be removed efficiently without causing a deterioration of the met
Echigo Noriyasu
Honda Kazuyoshi
Odagiri Masaru
Sugimoto Takanori
Ha Nguyen
Matsushita Electric - Industrial Co., Ltd.
Merchant & Gould P.C.
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