Electronic device and leadframe and methods for producing...

Details Electronic device and leadframe and methods for producing... Electronic device and leadframe and methods for producing...

2005-08-23

2005-08-23

Jackson, Jerome (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S684000, C257S787000, C438S597000

Reexamination Certificate

active

06933595

ABSTRACT:
The invention relates to an electronic device and a leadframe and to methods for producing the electronic device and the leadframe. The electronic device has a semiconductor chip with a top side fixed on a rewiring plate by a double-sided adhesive film. The underside of the rewiring plate has an edge region with through openings. The through openings are filled with a plastics compound that holds together the semiconductor chip and the rewiring plate by acting as a mechanical clip.

REFERENCES:
patent: 5064706 (1991-11-01), Ueda et al.
patent: 5150193 (1992-09-01), Yasuhara et al.
patent: 5182853 (1993-02-01), Kobayashi et al.
patent: 5847446 (1998-12-01), Park et al.
patent: 5849608 (1998-12-01), Abe
patent: 6097609 (2000-08-01), Kabadi
patent: 6143981 (2000-11-01), Glenn
patent: 6191490 (2001-02-01), Huang
patent: 6265768 (2001-07-01), Su et al.
patent: 6297543 (2001-10-01), Hong et al.
patent: 37 01 310 (1988-07-01), None

Affiliated with

Also associated with

Rating

Electronic device and leadframe and methods for producing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic device and leadframe and methods for producing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device and leadframe and methods for producing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3445122