Electronic device, and its fabrication method

Details Electronic device, and its fabrication method Electronic device, and its fabrication method

1999-06-07

2000-09-26

Bettendorf, Justin P.

Wave transmission lines and networks

Coupling networks

Frequency domain filters utilizing only lumped parameters

3613213, 3613214, 338254, H03H 102

Patent

active

061247693

ABSTRACT:
The invention provides an electronic device comprising a first metal layer containing a first metal converted into an oxide upon firing in an oxidizing atmosphere and a second metal layer formed by firing of a second metal particle containing a metal that is not oxidized upon firing in an oxidizing atmosphere, with an intermediate oxide layer interleaved between these two metal layers. The intermediate oxide layer contains an oxide of the first metal contained in the first metal layer. Preferably, the second metal particle contained in the second metal layer is dispersed in the intermediate oxide layer. A uniform oxide layer is obtained at a simple step, and the resistance value provided by the oxide layer is easily controllable with high precision. It is thus possible to achieve an electronic device in which the bonding strength of the oxide layer with respect to the other metal-containing layer is improved with an improvement in the bonding strength with respect to lead wires.

REFERENCES:
patent: 3353124 (1967-11-01), Dilger

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